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μ PC8187TB
15. NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Connect a bypass capacitor to the V CC pin.
(4) Connect a matching circuit to the RF output pin.
(5) The DC cut capacitor must be each attached to the input and output pins.
16. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and condi-
tions other than those recommended below, contact your NEC sales representative.
S o l d e r i n g M e t h o d
Infrared Reflow
VPS
Wave Soldering
Partial Heating
S o l d e r i n g C o n d i t i o n s
Package peak temperature: 235 ° C or below
Time: 30 seconds or less (at 210 ° C)
Count: 3, Exposure limit: None Note
Package peak temperature: 215 ° C or below
Time: 40 seconds or less (at 200 ° C)
Count: 3, Exposure limit: None Note
Soldering bath temperature: 260 ° C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None Note
Pin temperature: 300 ° C
R e c o m m e n d e d C o n d i t i o n S y m b o l
IR35-00-3
VP15-00-3
WS60-00-1
?
Time: 3 seconds or less (per side of device)
Exposure limit: None Note
Note After opening the dry pack, keep it in a place below 25 ° C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E) .
Data Sheet P15106EJ2V0DS
29
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